The type dimension of the X-ray Metrology market is delineated by the underlying physical principle and instrumentation used to acquire dimensional data. Primary categories include X-ray diffraction (XRD), which quantifies lattice spacing and crystallographic orientation; X-ray imaging, which provides two‑dimensional projection images for defect detection; X-ray tomography, delivering three‑dimensional volumetric reconstructions essential for complex geometry analysis; and X-ray scatter techniques, which infer surface roughness and thin‑film thickness through angular distribution of scattered photons. Each type commands a distinct cost structure, resolution capability, and throughput, thereby influencing its share of the overall market. XRD and tomography, owing to their high precision and applicability in semiconductor wafer inspection, together account for roughly 55% of total revenues. Imaging and scatter, while lower‑cost and faster, serve broader industrial inspection roles and contribute the remaining 45%, reflecting a balanced yet differentiated market composition.