Within the Types classification, Phenolic Resins for Photoresist are segmented into Novolac‑based, Resol‑based, and Modified phenolic families, each further divided into sub‑categories that affect performance and cost. Novolac‑based resins, typically low‑molecular‑weight, are prized for rapid dissolution and fine‑feature resolution, representing the bulk of lithography‑grade supplies. Resol‑based resins, characterized by higher molecular weight and self‑curing capability, dominate the PCB sector where thermal endurance is critical. Modified phenolics—including fluorinated, epoxy‑blended, and nanocomposite variants—address niche requirements such as enhanced chemical resistance or reduced out‑gassing in MEMS fabrication. The relative market share of each type aligns with the application distribution: Novolac aligns with the 55 % semiconductor share, Resol with the 30 % PCB share, and Modified phenolics with the 15 % MEMS share. This taxonomy clarifies how resin chemistry directly correlates with the functional demands of each application segment, shaping overall market composition.