The Types segment categorises PEEK retaining rings by manufacturing approach and mechanical configuration, chiefly as Injection‑Moulded, Machined, and Hybrid‑Formed variants. Injection‑Moulded rings dominate the volume market, comprising roughly 55 % of shipments, due to their cost‑effective mass production and tight tolerances suitable for standard wafer‑carrier interfaces. Machined rings, about 30 % of the market, are preferred for high‑precision, low‑run applications where custom geometries or tighter surface‑finish requirements are critical, leveraging CNC precision to achieve sub‑micron flatness. Hybrid‑Formed rings, the remaining 15 %, combine additive‑layered pre‑forms with post‑processing machining to deliver tailored material properties such as graded modulus or integrated venting channels, addressing niche demands in next‑generation 3‑D integration. The distribution of these type categories directly shapes the overall market valuation by aligning production costs, performance attributes, and supply‑chain flexibility with the specific needs of semiconductor CMP processes.