Segmentation by type classifies Nano-pattern Inspection Systems into optical‑based, electron‑beam‑based, and hybrid solutions, each contributing distinct value propositions to the market. Optical‑based systems, leveraging interferometric and scatterometry techniques, dominate with roughly 60% of installations due to their high throughput and non‑destructive nature, suitable for wafer‑scale monitoring. Electron‑beam‑based instruments, which provide sub‑nanometer resolution through scanning electron microscopy (SEM) or transmission electron microscopy (TEM), capture about 30% of the market, favored for failure analysis and critical dimension verification in high‑density interconnects. Hybrid configurations, integrating optical pre‑screening with localized electron‑beam confirmation, occupy the remaining 10%, addressing the trade‑off between speed and resolution for specialized processes. The distribution of these types reflects manufacturers' strategic balance between inspection speed, defect sensitivity, and cost, thereby influencing overall market growth and shaping technology adoption pathways.