Segmentation by type categorizes the gases themselves into four functional families, each with distinct sub‑categories that influence procurement and pricing dynamics. Fluorinated gases (e.g., NF₃, SF₆, C₄F₈) provide high‑reactivity for plasma etching and are the largest cost driver due to their environmental regulation and handling requirements. Inert gases such as argon and helium serve as carrier and purge media, offering stability but limited chemical activity, thus representing a lower‑margin segment. Reactive gases include oxygen, nitrogen, and hydrogen, which are essential for resist stripping and surface oxidation, balancing moderate cost with high process utility. Finally, Specialty gases—including high‑purity ammonia, chlorine‑based chemistries, and custom blends—address niche lithographic steps like selective deposition or advanced patterning, commanding premium pricing despite modest volumes. This type‑based taxonomy clarifies how each gas family contributes to total market size and informs strategic sourcing decisions across the Lithography Gases for Electronics market.