The Types segmentation of the Hexagonal Boron Nitride Thermal Filler market distinguishes between Powder, Platelet, and Nanoparticle forms, each delivering distinct performance profiles. Powder‑grade h‑BN (average particle size 5‑20 µm) dominates the market due to its cost‑effectiveness and ease of dispersion in polymer matrices, supporting bulk applications where moderate thermal conductivity is sufficient. Platelet‑type h‑BN (2‑10 µm lateral dimensions, high aspect ratio) commands a premium segment, offering anisotropic heat‑flow pathways that enhance in‑plane conductivity, making it suitable for printed circuit boards and thermal interface materials. Nanoparticle h‑BN (≤100 nm) represents a niche but rapidly growing sub‑segment, leveraged for its ability to form percolating networks at low loading levels, thereby preserving mechanical integrity while achieving high thermal performance. The relative adoption of each type is dictated by cost constraints, processing compatibility, and target thermal conductivity, collectively influencing the market’s total addressable volume without overlapping the application‑based chart data.