Types segmentation distinguishes the market by structural and functional design. Heat pipes are categorized by wick structure (sintered, grooved, mesh) and geometry (cylindrical, flat, loop). Sintered‑wick pipes excel in high‑heat‑flux environments due to superior capillary action, while grooved designs favor low‑cost, moderate‑flux uses. Flat heat pipes enable integration into compact PCB stacks, expanding their role in mobile devices. Vapor chambers are classified by chamber shape (planar, 3‑D) and fill material (water, ammonia, refrigerants). Planar chambers provide uniform temperature distribution across large surfaces, critical for high‑power LEDs and VR headsets, whereas 3‑D chambers address point‑source hotspots in power electronics. The choice between heat pipe and vapor chamber hinges on thermal load, spatial constraints, and cost considerations, directly shaping each sub‑segment’s contribution to total market volume. As system designs converge toward higher power densities, the relative weight of advanced wick technologies and high‑efficiency refrigerants is expected to increase within the overall market taxonomy.