Segmentation by types of Green SiC distinguishes three core product families, each with distinct sub‑categories that influence the market's structural composition. Epitaxial wafers—available in 4‑inch, 6‑inch, and emerging 8‑inch diameters—serve as the substrate for high‑power devices, with larger diameters driving cost efficiencies through higher yield. Discrete power devices include MOSFETs, Schottky diodes, and IGBTs, each optimized for specific voltage and current ratings; the MOSFET sub‑type dominates due to its superior switching speed, while Schottky diodes capture niche high‑frequency markets. Integrated modules—such as SiC‑based power modules, inverters, and driver ICs—combine multiple discrete elements into compact, system‑level solutions, facilitating faster time‑to‑market for OEMs. The relative revenue contribution of each type aligns with application demand: epitaxial wafers underpin the entire supply chain, discrete devices capture the bulk of automotive and industrial orders, and integrated modules expand in renewable‑energy and consumer segments where system integration adds value.