Application segmentation of the Extreme Ultraviolet (EUV) Photoresist market is dominated by three primary end‑uses. The logic chip fabrication segment, encompassing high‑performance CPUs and ASICs, accounts for roughly 55 % of total revenue because leading foundries such as TSMC and Samsung rely on EUV resists to pattern sub‑7 nm nodes, driving the largest volume of consumables. The memory chip fabrication segment, which includes DRAM and NAND production, contributes about 30 % of the market; although memory cycles are shorter, the shift toward 3‑D stacking and EUV‑enabled patterning raises resist consumption proportionally. The remaining 15 % is attributed to advanced packaging and research & development activities, where EUV resists are employed for interposer, fan‑out wafer‑level packaging, and prototype processes. The logic segment’s growth is driven by EUV patterning at 13.5 nm, which cuts mask count and cycle time, raising resist throughput. Memory benefits from EUV‑compatible high‑k gates, and advanced packaging gains from heterogeneous integration. These dynamics shape the revenue distribution shown in the chart, illustrating the overall Extreme Ultraviolet (EUV) Photoresist segmentation.