The Types segmentation distinguishes fluid formulations based on particle size distribution, dispersant chemistry, and pH control, typically classified as Standard Alumina Slurries, Ultra‑Fine Alumina Slurries, and Hybrid Alumina‑Silica Slurries. Standard slurries, with particle diameters of 0.2–0.5 µm, capture the bulk of the market (approximately 55 %) because they meet the performance‑cost balance for most bulk‑etch processes. Ultra‑fine slurries, featuring sub‑0.1 µm particles, represent about 30 % of sales, catering to advanced nodes where sub‑nanometer surface roughness is mandatory. Hybrid formulations, which blend alumina with silica or other abrasives to tailor removal rates, account for the remaining 15 % and are adopted in niche applications requiring both high selectivity and low defectivity. Each type’s market share reflects its contribution to overall revenue, guided by process‑specific requirements and the incremental cost premium associated with tighter particle control, thereby defining the market taxonomy for Alumina Polishing Fluid for Semiconductors.