The type dimension of the 400G Silicon Optical Module market is primarily divided into CFP2, CFP4, QSFP‑DD, OSFP, and COBO form factors. CFP2 modules, with their larger form factor, dominate early‑stage deployments where power budget and thermal management are less constrained, contributing roughly 22% of total module revenue. CFP4, a scaled‑down variant, offers a balance between size and performance, accounting for about 18% as hyperscale operators migrate to denser rack designs. QSFP‑DD, engineered for high‑density environments, has become the fastest‑growing segment, now representing approximately 30% of the market due to its compatibility with emerging 400G Ethernet standards. OSFP provides superior thermal performance and is favored in carrier‑grade applications, holding a 20% share. COBO (Coherent‑Based Optical) modules, although niche, address long‑haul coherent transmission needs and contribute the remaining 10%. Collectively, these form‑factor distinctions shape the overall 400G Silicon Optical Module segmentation, influencing design cycles, supply‑chain allocation, and pricing dynamics across the ecosystem.